Cypress Semiconductor MoBL CY62157EV30 Bedienungsanleitung PDF herunterladen (Seite 5)

CY62157EV30 MoBL

Document #: 38-05445 Rev. *H Page 5 of 17

Capacitance

Tested initially and after any design or process changes that may affect these parameters.

Parameter Description Test Conditions Max Unit

Input capacitance T

= 25°C, f = 1 MHz,

= V

CC(typ)

10 pF

OUT

Output capacitance 10 pF

Thermal Resistance

Tested initially and after any design or process changes that may affect these parameters.

Parameter Description Test Conditions BGA TSOP I TSOP II Unit



Thermal resistance

(Junction to Ambient)

Still air, soldered on a 3 × 4.5 inch,

two-layer printed circuit board

72 74.88 76.88 C/W



Thermal resistance

(Junction to Case)

8.86 8.6 13.52 C/W

Figure 4. AC Test Loads and Waveforms

Parameters 2.5V 3.0V Unit

R1 16667 1103 

R2 15385 1554 

8000 645 

1.20 1.75 V

OUTPUT

30 pF

INCLUDING

JIG AND

SCOPE

GND

90%

10%

90%

10%

Rise Time = 1 V/ns

Fall Time = 1 V/ns

OUTPUT V

Equivalent to: THÉ VENIN EQUIVALENT

ALL INPUT PULSES

[+] Feedback

1 2 3 4 5 6 7 8 9 10 ... 16 17

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