Cypress Semiconductor Perform CY7C1380D Bedienungsanleitung

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18-Mbit (512K x 36/1M x 18) Pipelined SRAM
CY7C1380D, CY7C1380F
CY7C1382D, CY7C1382F
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document #: 38-05543 Rev. *E Revised Feburary 07, 2007
Features
Supports bus operation up to 250 MHz
Available speed grades are 250, 200, and 167 MHz
Registered inputs and outputs for pipelined operation
3.3V core power supply
2.5V or 3.3V IO power supply
Fast clock-to-output times
2.6 ns (for 250 MHz device)
Provides high-performance 3-1-1-1 access rate
User selectable burst counter supporting Intel
®
Pentium
®
interleaved or linear burst sequences
Separate processor and controller address strobes
Synchronous self-timed write
Asynchronous output enable
Single cycle chip deselect
CY7C1380D/CY7C1382D available in JEDEC-standard
Pb-free 100-pin TQFP, Pb-free and non Pb-free 165-ball
FBGA package. CY7C1380F/CY7C1382F available in
Pb-free and non Pb-free 119-ball BGA package
IEEE 1149.1 JTAG-Compatible Boundary Scan
ZZ sleep mode option
Functional Description
[1]
The CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F
SRAM integrates 524,288 x 36 and 1,048,576 x 18 SRAM
cells with advanced synchronous peripheral circuitry and a
two-bit counter for internal burst operation. All synchronous
inputs are gated by registers controlled by a positive edge
triggered clock input (CLK). The synchronous inputs include
all addresses, all data inputs, address-pipelining chip enable
(CE
1
), depth-expansion chip enables (CE
2
and CE
3
[2]
), burst
control inputs (ADSC, ADSP, and ADV), write enables (BW
X
,
and BWE), and global write (GW). Asynchronous inputs
include the output enable (OE
) and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when address strobe processor (ADSP
) or address
strobe controller (ADSC) are active. Subsequent burst
addresses can be internally generated as they are controlled
by the advance pin (ADV
).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed write cycle.This part supports byte write
operations (see Pin Definitions on page 6 and Truth Table
[4,
5, 6, 7, 8]
on page 9 for further details). Write cycles can be one
to two or four bytes wide as controlled by the byte write control
inputs. GW
when active LOW causes all bytes to be written.
The CY7C1380D/CY7C1382D/CY7C1380F/CY7C1382F
operates from a +3.3V core power supply while all outputs
operate with a +2.5 or +3.3V power supply. All inputs and
outputs are JEDEC-standard and JESD8-5-compatible.
Selection Guide
250 MHz 200 MHz 167 MHz Unit
Maximum Access Time 2.6 3.0 3.4 ns
Maximum Operating Current 350 300 275 mA
Maximum CMOS Standby Current 70 70 70 mA
Notes:
1. For best practices or recommendations, please refer to the Cypress application note AN1064, SRAM System Design Guidelines on www.cypress.com.
2. CE
3,
CE
2
are for TQFP and 165 FBGA packages only. 119 BGA is offered only in 1 chip enable.
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Inhaltsverzeichnis

Seite 1 - CY7C1382D, CY7C1382F

18-Mbit (512K x 36/1M x 18) Pipelined SRAMCY7C1380D, CY7C1380FCY7C1382D, CY7C1382FCypress Semiconductor Corporation • 198 Champion Court • San Jose,

Seite 2 - (1M x 18)

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 10 of 30Truth Table for Read/Write [4, 9]Function (CY7C1380D/CY7C1380F) GW B

Seite 3 - Pin Configurations

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 11 of 30IEEE 1149.1 Serial Boundary Scan (JTAG)The CY7C1380D/CY7C1382D incor

Seite 4 - CY7C1380F (512K x 36)

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 12 of 30When the TAP controller is in the Capture-IR state, the twoleast sig

Seite 5 - CY7C1382D (1M x 18)

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 13 of 30When this scan cell, called the “extest output bus tri-state,” islat

Seite 6

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 14 of 303.3V TAP AC Test ConditionsInput pulse levels ...

Seite 7

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 15 of 30Identification Register DefinitionsInstruction FieldCY7C1380D/CY7C13

Seite 8

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 16 of 30119-Ball BGA Boundary Scan Order[14, 15] Bit # Ball ID Bit # Ball ID

Seite 9

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 17 of 30165-Ball BGA Boundary Scan Order[14, 16]Bit # Ball ID Bit # Ball ID

Seite 10

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 18 of 30Maximum RatingsExceeding the maximum ratings may impair the useful l

Seite 11

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 19 of 30Capacitance [19]Parameter Description Test Conditions100 TQFPPackage

Seite 12

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 2 of 30Logic Block Diagram – CY7C1380D/CY7C1380F [3] (512K x 36)Logic Block

Seite 13

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 20 of 30Switching Characteristics Over the Operating Range [20, 21]Parameter

Seite 14

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 21 of 30Switching Waveforms Read Cycle Timing [26]tCYCtCLCLKADSPtADHtADSADDR

Seite 15

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 22 of 30Write Cycle Timing [26, 27]Switching Waveforms (continued)tCYCtCLCL

Seite 16

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 23 of 30Read/Write Cycle Timing [26, 28, 29]Switching Waveforms (continued)

Seite 17

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 24 of 30ZZ Mode Timing [30, 31]Switching Waveforms (continued)tZZISUPPLYCLK

Seite 18

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 25 of 30Ordering InformationNot all of the speed, package and temperature ra

Seite 19

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 26 of 30250 CY7C1380D-250AXC 51-85050 100-pin Thin Quad Flat Pack (14 x 20 x

Seite 20

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 27 of 30Package Diagrams Figure 1. 100-Pin Thin Plastic Quad Flat pack (14 x

Seite 21

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 28 of 30Figure 2. 119-ball BGA (14 x 22 x 2.4 mm) (51-85115)Package Diagrams

Seite 22

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 29 of 30© Cypress Semiconductor Corporation, 2006-2007. The information cont

Seite 23

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 3 of 30Pin Configurations AAAAA1A0NC/72MNC/36MVSSVDDAAAAAAAADQPBDQBDQBVDDQVS

Seite 24

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 30 of 30Document History PageDocument Title: CY7C1380D/CY7C1382D/CY7C1380F/C

Seite 25

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 4 of 30Pin Configurations (continued)2345671ABCDEFGHJKLMNPRTUVDDQNC/288MNC/

Seite 26

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 5 of 30Pin Configurations (continued)165-Ball FBGA Pinout (3 Chip Enable)CY

Seite 27

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 6 of 30Pin DefinitionsName IO DescriptionA0, A1, A Input-SynchronousAddress

Seite 28

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 7 of 30Functional OverviewAll synchronous inputs pass through input register

Seite 29

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 8 of 30presented to A is loaded into the address register and theaddress adv

Seite 30

CY7C1380D, CY7C1380FCY7C1382D, CY7C1382FDocument #: 38-05543 Rev. *E Page 9 of 30Truth Table [4, 5, 6, 7, 8]Operation Add. Used CE1CE2CE3ZZ ADSP ADSC

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