Cypress Semiconductor enCoRe CY7C604XX Bedienungsanleitung Seite 27

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CY7C603xx
Document #: 38-16018 Rev. *D Page 27 of 29
Figure 14. 32-Lead QFN (5 x 5 mm)
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Thermal Impedances Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to
achieve good solderability.
0.50 DIA.
4.65
C
0.93 MAX.
N
SEATING
PLANE
N
2
2
0.23±0.05
0.50
1
1
0.05
-12°
0.30-0.50
0.05 MAX.
C
0.20 REF.
0.80 MAX.
PIN1 ID
3.50
0.42±0.18
(4X)
4.85
5.10
4.90
0.20 R.
0.45
3.70
3.70
4.85
4.65
4.90
5.10
3.50
TOP VIEW
BOTTOM VIEW
SIDE VIEW
DIMENSIONS IN mm MIN.
MAX.
JEDEC # MO-220
Package Weight: 0.054 grams
51-85188-*A
Table 30.Thermal Impedances per Package
Package Typical T
JA
* Typical T
JC
28 SSOP 96 °C/W 39 °C/W
32 QFN 22 °C/W 12 °C/W
* T
J
= T
A
+ Power x T
JA
Table 31.Solder Reflow Peak Temperature
Package
Minimum Peak
Temperature*
Maximum Peak
Temperature
28 SSOP 240°C 260°C
32 QFN 240°C 260°C
*Higher temperatures may be required based on the solder
melting point. Typical temperatures for solder are 220±5°C
with Sn-Pb or 245±5°C with Sn-Ag-Cu paste. Refer to the
solder manufacturer specifications.
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