
Design Considerations for ISR Programming of Cypress CPLDs
18
tion devices. For the F
LASH
370i it is permissible to actually let
the JTAGen pin float to retain the I/O capability of dual-mode
pins. For the Ultra37000 devices this pin must be driven to a
LOW level to ensure the I/O functionality. For Ultra37128 and
smaller devices a weak pull-down device replaces the bus-
hold latch on the JTAGen pin. This pull-down device (see the
data sheet parameter I
JTAG
, which shows the strength of the
pull-down device) keeps the pin in the LOW state after pro-
gramming and prevents the need for external biasing on the
JTAGen pin if a Ultra37000 device replaces a F
LASH
370i de-
vice. Early Ultra37256P160 silicon did not have this pull down
device on the JTAGen pin but more recent silicon has this
device. If the pull-down device is not employed then a bus-
hold latch is employed and this latch could hold a HIGH value
on the pin. With multiple devices in the chain, some devices
being Ultra37128 and smaller and some being
Ultra37256P160 early silicon or F
LASH
370i devices, it is still
possible for the JTAGen pin to be pulled into the HIGH state.
Two methods for driving the JTAGen pin LOW, using a exter-
nal pull-down resistor and using an external component are
presented.
Using a Pull-down Resistor to Drive the JTAGen Pin LOW
to Use the I/O Function of the Dual-Function Pins
The JTAGen pin can be held at a TTL LOW by using a pull-
down resistor to ground. This works fine provided there are
not too many devices in the ISR chain. The problem with the
simple resistor is that the bus-hold latches on the JTAGen
pins may disturb the pull-down operation if there are many
other F
LASH
370i devices in the chain. This is because the bus-
hold latches that are connected in parallel produce a lower
source impedance. The bus-hold latch differences between
the two ISR family members are discussed further in this note.
The resistor must be able to provide a low enough resistance
to overpower the combined bus-hold latches in parallel such
that the voltage on the JTAGen pin drops below the trip point
(V
trip
) of the bus-hold latches. Once the JTAGen pin voltage
drops below V
trip
all the bus-hold latches connected in parallel
will flip to the desired LOW state. The maximum resistance
that is guaranteed to overpower N F
LASH
370i bus-hold latch-
es in parallel is given by the formula:
R
pulldown
= V
trip
/(N*(I
BHHO
))
where V
trip
is 1.5V and I
BHHO
is –500 µA (maximum current
that is guaranteed to invert the state of a single bus-hold
latch). R
pulldown
is 3 kΩ for 1 device, 600Ω for 5 devices, and
300Ω for 10 devices in the chain. It is recommended that the
number of devices in the chain be limited to 5 devices if the
other devices in the chain are all F
LASH
370i devices. The
above limitation of 5 devices in the chain is suggested be-
cause the resistor value would need to be reduced which
would place too high a DC current load on the JTAGen signal
driven to 12V from the ISR cable. With a pull-down resistance
of 600Ω, the DC current load on the JTAGen pin is 12/600 or
20 mA, which is an acceptable load. Resistor values less than
600Ω would require a higher wattage resistor than the stan-
dard 1/4 watt rating, assuming 12V is needed for program-
ming F
LASH
370i devices in the same chain. If only
Ultra37256P160 early silicon devices are in the chain and the
UltraISRPCCABLE is used then the JTAGen pin only goes to
a TTL HIGH so the number of devices in the chain can be
increased to 10. The above restriction of the pull-down resis-
tor can be avoided by using an external component to choose
between a TTL HIGH level and a TTL LOW level on the
JTAGen pin. Again the need for external biasing may not be
needed in many case because of the pull-down device incor-
porated on the Ultra37128 devices and smaller and to be in-
cluded on the Ultra37256 as well.
Using an External Component to Drive the JTAGen Pin
LOW to Use the I/O Function of the Dual-Function Pins
The JTAGen pin can be driven LOW using any of the solutions
already presented in Figure 14 regarding using the dual-
function pins in dual-function mode. The only difference is that
the JTAG input is JTAGen, which is tied to V
CC
instead of one
of the four JTAG pins and the “signal” input is connected to
ground. You may be able to use unused resources in the ex-
ternal component solutions presented in Figure 14 to imple-
ment this logic. Any of these solutions can be used for multiple
Ultra37000 devices ganged together. Figure 22 shows two
examples for driving the JTAGen pin from the control of signal
ISR*. As mentioned before, a pull-up resistor is also needed
on the ISR* signal at the 10-pin header connector.
Figure 23 shows the JTAGen pin driven by an extra I/O pin of
the Ultra37000 device by simply inverting the ISR* control
signal. This would seem to be a simple alternative to adding
extra components. This solution, however, won’t work. The
problem is that the I/O pins of the device enter three-state
when the ISR mode is enabled (JTAGen driven HIGH). Be-
cause the I/O is three-stated there is no way to drive the
JTAGen pin LOW. The dual-function pins are stuck in the
JTAG function because the bus-hold latch, which is always
enabled, has latched a HIGH level on the pin. Figure 24
shows how to combine dual-function F
LASH
370i and
Ultra37000 devices in the same chain with the appropriate
JTAGen connections assuming the user wants to use one
dual-function pin in dual-function mode for each of the
Ultra37000 devices. The figure shows that one mux can be
used for two Ultra37000 devices but many more devices can
use the same mux output signal. In this example the TMS pin
on both Ultra37000 devices is used in dual-function mode
where the I/Os are used as JTAG pins and as input pins. The
Figure 22. JTAGen Driven for the Ultra37000
Ultra37000
JTAGen
ISR*
0
1
y
S
Ultra37000
5 volts
JTAGen
ISR*
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